Centrotherm c.VACUNITE 300A/300/180 Vacuum Soldering System

Centrotherm c.VACUNITE 300A/300/180

Large-Area Vacuum Soldering System for High-Volume Production

Centrotherm c.VACUNITE 300A/300/180

The **c.VACUNITE 300A/300/180** is a powerful vacuum soldering system with a large process area, designed for series production of power modules, advanced packaging and other high-reliability applications. It combines excellent temperature uniformity with highly efficient void reduction.

Key Features & Benefits

  • Large process area: 300 × 300 mm (or up to 300 × 180 mm depending on configuration)
  • Outstanding temperature uniformity of ±0.5% across the entire heating plate
  • Void-affected area can be reduced to less than 1%
  • Fast heating and cooling rates for short cycle times
  • Maximum process temperature up to 450 °C
  • Process under pure nitrogen, hydrogen, formic acid or forming gas
  • Surface activation and oxide reduction capabilities
  • Modular and highly scalable system
  • Advanced process control with recipe management
  • Industry 4.0 ready with remote access and data logging

Typical Applications

  • Power semiconductor modules (IGBT, SiC, GaN)
  • Advanced packaging and 3D packaging
  • Hermetic package sealing
  • High-reliability microelectronic assemblies
  • Optoelectronics and LED packaging
  • Wafer level bonding
  • Copper annealing and sintering

Downloads

Official Product Page

Contact us for detailed technical specifications, configuration options and quotation.

Manufacturer: Centrotherm • Source: Official Centrotherm Materials • Generated May 2026


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